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Cushioning material for manufacturing - List of Manufacturers, Suppliers, Companies and Products

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Cushion material for printed circuit board manufacturing "ACE BOARD(R)"

Cushion material for substrate manufacturing that combines high heat resistance and lasting cushioning properties.

"ACE BOARD(R)" is a high-performance heat-resistant cushioning material made from high-heat-resistant fibers. It is widely used in the production of printed circuit boards for smartphones and various other high-temperature pressing applications. 【Features】 ■ A wide range of options tailored to temperature ranges and required cushioning properties ■ Maintenance of cushioning properties: long life, reduction of waste ■ Non-gas: no generation of harmful gases 【Exhibition Information】 ■ Exhibition Name: New Functional Materials Exhibition 2026 ■ Venue: Tokyo Big Sight, West Exhibition Hall ■ Booth Number: 3W-F25, 3W-F28 (within the Japan Nonwoven Fabrics Association booth) ■ Address: 3-11-1 Ariake, Koto-ku, Tokyo 135-0063 ■ Nearest Stations: - Rinkai Line "Kokusai Tenjijo" Station, about a 7-minute walk - Yurikamome "Tokyo Big Sight" Station, about a 3-minute walk *For more details, please download the PDF or contact us. Samples are also available.

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Cushion Material for Printed Circuit Board Manufacturing "ACE BOARD C Series"

Recommended for CEM-1, CEM-3, and FR-1 substrates! Supports automatic transport via suction.

The "ACE BOARD C Series" is a cushioning material for printed circuit board manufacturing that can be used at a press temperature of 200°C. It possesses both cushioning and thermal conductivity properties, making it reusable. You can select an appropriate cushioning material. Please feel free to consult us when needed. 【Features】 ■ Combines cushioning and thermal conductivity properties ■ Usable at a press temperature of 200°C ■ Reusable ■ Compatible with automatic transport through adhesion *For more details, please refer to the PDF document or feel free to contact us.

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Cushion material for printed circuit board manufacturing "ACE BOARD Z Series"

The decomposition temperature of the structural fiber (PBO) is 650°C! Recommended for LCP and fluorine substrates, etc.

The "ACE BOARD Z Series" is a cushioning material for printed circuit board manufacturing that possesses both cushioning properties and thermal conductivity. It can be used at press temperatures of 300°C to 500°C or lower and is reusable. Additionally, the decomposition temperature of the constituent fiber (PBO) is 650°C. Please feel free to consult us when you need assistance. 【Features】 ■ Combines cushioning properties and thermal conductivity ■ Usable at press temperatures of 300°C to 500°C or lower ■ Reusable *For more details, please refer to the PDF document or feel free to contact us.

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